MatAMet — Institute for Materials, Advanced Manufacturing & Metallurgy

Metals & alloys · Copper alloys

C10100 oxygen-free electronic copper

An ultra-high-purity oxygen-free copper used where electrical conductivity, vacuum compatibility and hydrogen-embrittlement resistance are critical.

Family
High-Purity Copper
Record
Reference
Conditions
1
Sources
1
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01

Overview

Material class
Metals & alloys
Category
Copper alloys
Family
High-Purity Copper
Product forms
Sheet/plate, Bar/rod

Composition

ConstituentMinMaxTypicalNote
Cu99.9999.99
O0.0005<0.0005

02

Properties and conditions

Engineering properties

PropertyValueUnitCondition
Density8.94g/cm³Representative; verify product form and condition
Electrical conductivity≥101% IACSannealed
Thermal conductivity~391W/m·KRepresentative; verify product form and condition
Yield strength~55–200MPatemper dependent
Tensile strength~220–350MPaRepresentative; verify product form and condition
Vacuum compatibilityhighclean condition

Conditions

reference

Representative supplied condition

Condition not fully specified in the source record.

03

Processing and use

Processing

  • Product form, thermal history and manufacturing route materially affect performance.

Applications

  • Vacuum electronics
  • Particle accelerators
  • High-conductivity busbars
  • Cryogenic systems

Selection considerations

  • Use the current governing standard and supplier certification for design or procurement.

Open in an analysis tool

04

Standards and related materials

Standards and designations

SystemDesignationNote
UNSC10100
ASTMB170 / B152product dependent

05

Sources and context

Sources

Confirm the applicable specification, product form and condition before using values for design or procurement.

Supply and sustainability

Availability and lead time depend on grade, product form, certification and regional supply chain.

Segregated recovery and closed-loop recycling improve material efficiency where practical.